Call for Papers

Friday, April 27 (All day)


Call For Papers – Now Open!

SEMICON Europa 2018

The Call for Papers for technical sessions and presentations for SEMICON Europa 2018, November 13-16 in Munich, Germany is open now.

We are pleased to invite you to contribute to SEMICON Europa technical sessions and presentations. The sessions will focus on critical industry topics that are shaping the design and manufacturing of semiconductors, MEMS, printed and flexible electronics, and other related technologies. This year Call for Papers is open for:

Advanced Packaging Conference (APC)

Technology trends – what´s new, what´s missing, what´s next Advanced packaging as indispensable part of the final electronic product is facing new challenges in achieving required higher performance, smaller form-factor, higher reliability levels and lower cost. This is driven by a continuously increasing number of new applications for instance in the field of IoT with integrated sensor and MEMS; different types of 5G connectivity solutions and mobile communication infrastructure; Automotive electronics for engine and transmission, chassis, safety, driver assistance, passenger comfort and infotainment; faster datacenters with more memory for big data; more space for battery and display in next generation mobile phones; the next generation imaging and image recognition systems in mobile devices; power electronics; processing cryptocurrency; and many others.

Advanced Packaging Conference (APC)
Click here to submit. (Deadline: April 27, 2018)

2018FLEX Europe – be flexible Conference

Innovations enabled by Flexible Electronics End users, supply chain companies, R&D organizations, start-ups and universities are invited to submit abstracts for the 2018FLEX Europe Conference. FLEX Europe Conference will be held in cooperation with Fraunhofer EMFT’s forum BE-FLEXIBLE. This two half-day conference, an integral part of SEMICON Europa 2018 co-located with electronica, will address materials, manufacturing, new technologies and applications for flexible hybrid electronics (FHE) and printed electronics (PE) and will demonstrate the strong history of Europe in the field.

2018FLEX Europe – be flexible Conference
Click here to submit. (Deadline: April 27, 2018)

Abstracts for presentations:

Prospective presenters are invited to submit abstracts (1,000–2,000 characters). Material must be original, non-commercial, and non-published. Abstracts must clearly detail the nature, scope, content, organization, key points, and significance of the proposed presentation.

Please submit your abstract here

Please click on above topics and you will receive the invitation.

We look forward to hearing from you!

Association Contact:

For questions or information on how to submit your Call for Papers please contact:
Christina Fritsch
SEMI Europe
Email: cfritsch@semi.org
Tel: +49 30 303080770

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